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Thank you for contacting MicroNanoFacility: pease fill in the following fields with some details about your request. We will reply to you asap and be glad to arrange further discussion to detail your needs.
product selection
Please select
R&D lots fabrication
Technology Platform based fabrication
Coated silicon wafers
other
technology
Please select
particle detectors
radiation detectors
physical sensors
chemical sensors
MEMS components
substrate wafer
Please select
standard silicon
high resistivity silicon
SOI
quartz
other - to be defined
substrate thickness
Please select
635um (standard)
350-450um
250-350um
double side processing
Please select
yes
no
wafers have to be patterned on both sides (yes) or on frontside only (no)
design critical dimension
Please select
>4um
2-4um
1-2um
0.5-1um
the size of the smallest feature to be patterned on wafer
number of mask levels
insert the number of lithography levels (masks) required for the fabrication of the device
required dielectric layers
thermal oxide
TEOS
BPSG
LPCVD polysilicon
LPCVD silicon nitride
LPCVD low stress SiN
PECVD silicon oxide
PECVD silicon nitride
PECVD amorph. silicon
other dielectric layers
doping
boron diffusion
phosphorus diffusion
ion implant (B,BF2,P,As,Ar)
required metal layers
Aluminum
Titanium
Titanium nitride
Chromium
Gold
Palladium
Platinum
Silver
other metal layers
wafer bonding
Please select
not required
anodic bonding
Au-Si eutectic bonding
glas frit bonding
adhesive bonding
electrical testing
Please select
not required
manual
automatic
wafer dicing
Please select
not required
required
packaging
Please select
not required
plastic
ceramic
TO
custom - to be defined
describe you request
your name
your affiliation
your e-mail contact
please confirm e-mail
your phone contact
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